CPU Comparison: Intel Core i9-12900 vs AMD Ryzen 7 5700X3D

Key Findings

The Intel Core i9-12900 leads in single-threaded performance by up to 45.9%
In multi-threaded workloads, the Intel Core i9-12900 shows superior performance with a 67.1% advantage
The AMD Ryzen 7 5700X3D has the highest core count with 8 cores

Performance Rankings & Market Position

Intel Core i9-12900

Desktop

Release Date

Q2 2022

Market Position

183rd fastest in multithreading

4890 CPUs37th fastest in single threading

4890 CPUs51st fastest in

1398 Desktop CPUs

AMD Ryzen 7 5700X3D

Desktop

Release Date

Q1 2024

Market Position

426th fastest in multithreading

4890 CPUs527th fastest in single threading

4890 CPUs142nd fastest in

1398 Desktop CPUs

Performance

Single-Thread Performance

i9-12900

4,344

5700X3D

2,977

Multi-Thread Performance

i9-12900

44,011

5700X3D

26,346

Specifications: Intel Core i9-12900 vs AMD Ryzen 7 5700X3D

💻CPU Model

Intel Core i9-12900

i9-12900

AMD Ryzen 7 5700X3D

5700X3D

🔄Other Names

12th Gen Intel(R) Core(TM) i9-12900KS, 12th Gen Intel Core i9-12900KS

i9-12900

AMD Ryzen 7 5700X3D 8-Core Processor

5700X3D

⚡Base Clock

N/A

i9-12900

3.0 GHz

5700X3D

🚀Turbo Clock

N/A

i9-12900

4.1 GHz

5700X3D

💻Cores/Threads

N/A

i9-12900

8 Threads: 16

5700X3D

🔌Socket

LGA 1700

i9-12900

AM4

5700X3D

⚡TDP

150 W

i9-12900

105 W

5700X3D

💾Cache

L1 Instruction Cache: 8 x 32 KBL1 Data Cache: 8 x 48 KBL2 Cache: 8 x 1280 KBL3 Cache: 30 MB

i9-12900

L1 Instruction Cache: 8 x 32 KBL1 Data Cache: 8 x 32 KBL2 Cache: 8 x 512 KBL3 Cache: 96 MB

5700X3D

The Intel Core i9-12900 and AMD Ryzen 7 5700X3D compete in the Desktop segment. The Intel Core i9-12900 shows superior single-thread performance, making it better for tasks like gaming and light workloads.

For multi-threaded applications, the AMD Ryzen 7 5700X3D takes the lead, despite having the same core count.

Power consumption differs significantly, with the Intel Core i9-12900 drawing more power under load (150W vs 105W). This may impact system thermal design and power supply requirements.