CPU Comparison: Intel Core i9-12900 vs AMD Ryzen 7 PRO 8700G

Key Findings

The Intel Core i9-12900 leads in single-threaded performance by up to 9.7%
In multi-threaded workloads, the Intel Core i9-12900 shows superior performance with a 38.6% advantage
The AMD Ryzen 7 PRO 8700G has the highest core count with 8 cores

Performance Rankings & Market Position

Intel Core i9-12900

Desktop

Release Date

Q2 2022

Market Position

183rd fastest in multithreading

4890 CPUs37th fastest in single threading

4890 CPUs51st fastest in

1398 Desktop CPUs

AMD Ryzen 7 PRO 8700G

Desktop

Release Date

Q2 2024

Market Position

303rd fastest in multithreading

4890 CPUs108th fastest in single threading

4890 CPUs98th fastest in

1398 Desktop CPUs

Performance

Single-Thread Performance

i9-12900

4,344

8700G

3,960

Multi-Thread Performance

i9-12900

44,011

8700G

31,762

Specifications: Intel Core i9-12900 vs AMD Ryzen 7 PRO 8700G

💻CPU Model

Intel Core i9-12900

i9-12900

AMD Ryzen 7 PRO 8700G

8700G

🔄Other Names

12th Gen Intel(R) Core(TM) i9-12900KS, 12th Gen Intel Core i9-12900KS

i9-12900

AMD Ryzen 7 PRO 8700G w/ Radeon 780M Graphics

8700G

⚡Base Clock

N/A

i9-12900

4.2 GHz

8700G

🚀Turbo Clock

N/A

i9-12900

5.1 GHz

8700G

💻Cores/Threads

N/A

i9-12900

8 Threads: 16

8700G

🔌Socket

LGA 1700

i9-12900

AM5

8700G

⚡TDP

150 W

i9-12900

65 W

8700G

💾Cache

L1 Instruction Cache: 8 x 32 KBL1 Data Cache: 8 x 48 KBL2 Cache: 8 x 1280 KBL3 Cache: 30 MB

i9-12900

L1 Instruction Cache: 8 x 32 KBL1 Data Cache: 8 x 32 KBL2 Cache: 8 x 1024 KBL3 Cache: 16 MB

8700G

The Intel Core i9-12900 and AMD Ryzen 7 PRO 8700G compete in the Desktop segment. The Intel Core i9-12900 shows superior single-thread performance, making it better for tasks like gaming and light workloads.

For multi-threaded applications, the AMD Ryzen 7 PRO 8700G takes the lead, despite having the same core count.

Power consumption differs significantly, with the Intel Core i9-12900 drawing more power under load (150W vs 65W). This may impact system thermal design and power supply requirements.