CPU Comparison: Intel Core i9-14900F vs Intel Xeon W-2275 @ 3.30GHz

Key Findings

  • The Intel Core i9-14900F leads in single-threaded performance by up to 62.5%
  • In multi-threaded workloads, the Intel Core i9-14900F shows superior performance with a 69.7% advantage
  • The Intel Xeon W-2275 @ 3.30GHz has the highest core count with 14 cores

Performance Rankings & Market Position

Intel Core i9-14900F

Desktop
Release Date
Q1 2024
Market Position
155th fastest in multithreading
4890 CPUs32nd fastest in single threading
4890 CPUs42nd fastest in
1398 Desktop CPUs

Intel Xeon W-2275 @ 3.30GHz

Desktop
Release Date
Q4 2020
Market Position
388th fastest in multithreading
4890 CPUs628th fastest in single threading
4890 CPUs131st fastest in
1398 Desktop CPUs

Performance

Single-Thread Performance

i9-14900F
4,472
3.30GHz
2,752

Multi-Thread Performance

i9-14900F
47,298
3.30GHz
27,866

Specifications: Intel Core i9-14900F vs Intel Xeon W-2275 @ 3.30GHz

💻CPU Model
Intel Core i9-14900F
i9-14900F
Intel Xeon W-2275 @ 3.30GHz
3.30GHz
🔄Other Names
Intel(R) Core(TM) i9-14900F
i9-14900F
Intel(R) Xeon(R) W-2275 CPU @ 3.30GHz
3.30GHz
⚡Base Clock
N/A
i9-14900F
3.3 GHz
3.30GHz
🚀Turbo Clock
N/A
i9-14900F
4.8 GHz
3.30GHz
💻Cores/Threads
N/A
i9-14900F
14 Threads: 28
3.30GHz
🔌Socket
FCLGA1700
i9-14900F
FCLGA2066
3.30GHz
⚡TDP
65 W
i9-14900F
165 W
3.30GHz
💾Cache
L1 Instruction Cache: 8 x 32 KBL1 Data Cache: 8 x 48 KBL2 Cache: 8 x 2048 KBL3 Cache: 36 MB
i9-14900F
L1 Instruction Cache: 14 x 32 KBL1 Data Cache: 14 x 32 KBL2 Cache: 14 x 1024 KBL3 Cache: 19 MB
3.30GHz

The Intel Core i9-14900F and Intel Xeon W-2275 @ 3.30GHz compete in the Desktop segment. The Intel Core i9-14900F shows superior single-thread performance, making it better for tasks like gaming and light workloads.

For multi-threaded applications, the Intel Xeon W-2275 @ 3.30GHz takes the lead, despite having the same core count.

Power consumption differs significantly, with the Intel Xeon W-2275 @ 3.30GHz drawing more power under load (165W vs 65W). This may impact system thermal design and power supply requirements.